Abstract
One of today's very critical and sensitive accurate accelerometer which can be used higher temperature than $200^{\circ}C$ and corrosive environment, is particularly demanded for automotive engine. Because silicon is a material of large temperature dependent coefficient, and the piezoresistors are isolated with p-n junctions, and its leakage current increase with temperature, the performance of the silicon accelerometer degrades especially after $150^{\circ}C$. In this paper, The temperature characteristic of a accelerometer using silicon on insulator (SOI) structure is studied theoretically, and compared with experimental results. The temperature coefficients of sensitivity and offset voltage (TCS and TCO) are related to some factors such as thermal residual stress, and are expressed numerically. Thermal stress analysis of the accelerometer has also been carried out with the finite-element method(FEM) simulation program ANSYS. TCS of this accelerometer can be reduced to control the impurity concentration of piezoresistors, and TCO is related to factors such as process variation and thermal residual stress on the piezoresistors. In real packaging, The avarage thermal residual stress in the center support structure was estimated at around $3.7{\times}10^4Nm^{-2}^{\circ}C^{-1}$ at sensing resistor. The simulated ${\gamma}_{pT}$ of the center support structure was smaller than one-tenth as compared with that of the surrounding support structure.
최근, 자동차가 점점 고급화 되어감에 따라 자동차엔진과 같이 $200^{\circ}C$ 이상의 고온과 부식적인 환경 하에 사용되어 질 수 있는 고성능의 실리콘 가속도센서의 장착이 기대되고 있다. 그러나 실리콘은 본질적으로 온도의 영향이 큰 물질이고, p-n 접합으로 압저항이 형성되기 때문에 $150^{\circ}C$ 이상이 되면 누설전류가 급격하게 증가하여 센서의 성능을 떨어뜨린다. 본 연구에서는 SOI 구조를 이용한 가속도센서의 온도특성을 해석하고, 유한요소법(finite element method)을 이용하여 감도 온도계수(TCS) 및 오프셋전압 온도계수(TCO)의 열잔류응력과의 관련성을 검토하였다. 그 결과, TCS는 압저항의 불순물 농도를 최적화함으로써 줄일 수 있고, TCO는 압저항의 열잔류응력과 불균일한 공정에 관계가 있다는 것을 알았다. 그리고 센서의 중앙지지구조에 있어서 패키징 열잔류응력의 평균값은 약 $3.7{\times}10^4Nm^{-2}^{\circ}C^{-1}$ 정도로 주변지지구조보다 1/10정도 작게 나타났다.
(School of Electrical & Electrical Engineering. Yeungnam University)