Journal of the Korean institute of surface engineering (한국표면공학회지)
- Volume 32 Issue 6
- /
- Pages.703-708
- /
- 1999
- /
- 1225-8024(pISSN)
- /
- 2288-8403(eISSN)
A study of microstructure of Ni-monosilicide fabricated with a thermal evaporator
열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구
Abstract
Silicides have been used extensively in ULSI logic device fabrication as contact materials for the active areas as well as the poly- Si gates. NiSi is a promising candidate for submicron device application due to less volume expansion, low formation temperature, little silicon consumption, and large stable processing temperature window. In this report, the microstructure of nickel silicides fabricated with a thermal evaporator has been investigated. We observed systematic transformation of Ni silicides of
Keywords