한국표면공학회지 (Journal of Surface Science and Engineering)
- 제32권3호
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- Pages.214-218
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- 1999
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- 1225-8024(pISSN)
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- 2288-8403(eISSN)
THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION
- Kim, Go-Eun (Dept. of Metallurgical Engineering and Materials Science Hongik University) ;
- Lee, Jae-Ho (Dept. of Metallurgical Engineering and Materials Science Hongik University)
- 발행 : 1999.06.01
초록
The effect of additives in nickel and copper electroplating were investigated for MEMS applications. Saccharin and gelatin were used as additives in nickel and copper electroplating bath respectively. The morphology and surface hardness of electroplated coating were investigated with additive concentration. Microstructures were fabricated with optimum conditions.