Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 6 Issue 2
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- Pages.31-36
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- 1999
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Efficient Approach to Thermal Modeling for IC Packages
효율적 수치해석기법을 이용한 반도체 페키지의 열방출 해석
- Seung Mo Kim (R&D Center, Anam Semiconductor, Inc.) ;
- Choon Heung Lee (R&D Center, Anam Semiconductor, Inc.)
- Published : 1999.06.01
Abstract
An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.
Keywords