References
- ISHM 94 Proceedings Multifunctional Ceramic Substrates and Packages for Telecommunication Applications C. Makihara;Ikeda;H. Wada;Y. Sawa;S. Tanahashi
- ISHM 96 Proceedings High Current Integrated Microinductors and Microtransformers using Low Temperature Fabrication Processes J. Y. Park;M. G. Allen
- ISHM 96 Proceedings Three Dimensional Flip Chip Packaging in LTCC for High Density Microwave Applications W. Marsh;M. Kline;F. Kuss;D. Strack
- IMC 1996 Proceedings Advanced Ceramic Multilayer funtional Packages for Telecommunications Equipment H. Mandai;N. Nakajima;K. Tongegawa
- ISHM 89 Proceedings Evaluation and Characterization of Low-Temperature Cofired Ceramic Structures for Microwave Applications J. R. Tyler;D.J. Gasper
- J. Am. Ceram. Soc. v.74 no.5 Ceramic and Glass-Ceramic Packaging in the 1990s R. R. Tummala
- JSHM 88 Proceedings Low Temperature Cofired CeramicTape System A Cost Effective Solution for Multilayer Packaging M.F. Bender;F.K. Patterson;E.A. Kemp;J.E. Gantzhorn,Jr.
- Proceeding of International Microelectronics Conference Co-Firable Copper Multilayered Ceramic Substrate T. Nishimura;S. Nakatani
- ISHM 96 Proceedings The Effect of Processing Parameters and Surface Roughness of Conductor Traces on the Microwave Properties of LTCC Structure S. Vasudevan
- ISHM 94 Proceedings Reliability Analysis of LTCC MCM's Utilizing Silver Conductives T. Martin;D. Schroeder
- ISHM 92 Proceedings Real Time Sintering Observations of LTCC Substrate and Conductor Materials W. S. Hackenberger;T. R. Shrout;J. P. Dougherty;R. F. Speyer
- 요업학회지 고주파용 저온 동시소성 세라믹(LTCC) 칩 커플러 제조 : I. 전극형성에 대한 결합제 분해공정의 영향 조남태;심광보;이선우;구기덕
- Scanning Electron Microscopy and X-ray Microanalysis : Chap. 3 Electron-Specimen Interaction J. I. Goldstein;A. D. Romig, Jr.;D. E. Newbury;C. E. Lyman;P. Echlin;C. Fiori;D. C. Joy;E. Lifshin