Abstract
$Si/Si_{1-x}Ge_x$ MODFET structures, incorporating linearly-graded buffer layers have been grown by GaS Source Molecular Beam Epitaxy. The growth temperature of the graded layers has not significantly changed the distribution of misfit dislocation. However, the surface undulation and surface defects were increased with increasing growth temperature. In $Si/Si_{1-x}Ge_x$ MODFET structures, the densities of misfit dislocations near the Si-active layers were considerably reduced in comparison with the region of graded layers. The electron mobility of $Si/Si_{1-x}Ge_x$ MODFET structure has increased with lowering the growth temperature.
가스원 분자선 에피택시(GS-MBE)로 성장시킨 $Si/Si_{1-x}Ge_x$ MODFET의 미세조직을 투과식 전자현미경과 간섭광학현미경을 이용하여 관찰하였다. 증착온도변화에 따른 불일치전위의 분포에 큰 변화는 없었지만, 증착온도가 높을수록 표면조도가 거칠어졌고 표면 결함이 나타났다. Si 전기활성층 근처에서는 조성경사기능층보다 전위밀도가 상당히 낮았다. 결정성장 온도를 낮춤에 따라 전기이동도는 증가하였다.