Analysis of X-ray image Qualities -accuracy of shape and clearness of image using X-ray digital tomosynthesis

디지털 영상 합성에 의한 X선 단층 영상의 형상 정확도와 선명도 분석

  • Roh, Yeong-Jun (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
  • Cho, Hyung-Suck (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Hyeong-Cheol (Production Technology Center, Samsung Electronics Corporation) ;
  • Kim, Sung-Kwon (Production Technology Center, Samsung Electronics Corporation)
  • 노영준 (한국과학기술원 기계공학과) ;
  • 조형석 (한국과학기술원 기계공학과) ;
  • 김형철 (삼성전자 생산기술센터) ;
  • 김성권 (삼성전자 생산기술센터)
  • Published : 1999.07.01

Abstract

X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promis to be good solutions for inspecting interior defects of industrial products. DT is a kind of laminography technique and the difference is in the fact that it synthesizes the several projected images by use of the digitized memory and computation. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria : (1) shape accuracy and (2) clearness of the cross-sectional images are defined. Based on these criteria, a series of simulations are performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum methods.

Keywords

References

  1. Integrated Circuit Metrology, Inspection, and Process Control V (SPIE) v.1464 X-ray laminography analysis of ultra fine pitch solder connections on ultra thin boards J. Adams
  2. IEMT Symposium An animated interface for X-ray laminographic inspection of fine-pitch interconnect S. Black;D. L. Millard;K. Nilson
  3. Proc Nepcon West'93 Inspection of very fine pitch connections on PCMCIA cards S. Rooks;M. Okimura;R. Urban
  4. IEEE Trans. Components, Packing, and Manufacturing Technology - Part A v.18 no.4 Development of an inspection process for ball-grid-array technology using scanned beam X-ray laminography S. Rooks;B. Benhabib;K. C. Smith
  5. US Patent 5081656 B. D. Baker;J. A. Adams
  6. Surface Mount International Conference (San Jose) X-ray inspection of flip chip attach using digital tomosynthesis S. Rooks;T. Sack
  7. French Patent 536464 A. E. M. Bocage
  8. Materials Evaluation Evaluation and qualification standards for an X-ray laminography system T. A. Siewert;M. W. Austin
  9. Materials Evaluation The contributions of out of plane materials to a scanned-beam laminography image T. A. Siewert;Mark W. Austin
  10. Handbook of X-rays E. F. Kaelble
  11. The Image Processing Handbook J. C. Russ
  12. IEEE ICRA'96 Visual inspection scheme for use in optical solder joint inspection system Y. K. Ryu;H. S. Cho
  13. Advanced Materials & Process Computed tomography details casting defects
  14. 공업용 방사선 투과 검사 이의종
  15. 연구보고서 X-ray를 이용한 PCB 납땜 검사 장치 개발 한국과학기술원