• Nuclear Engineering and Technology
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• v.53 no.5
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• pp.1626-1633
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• 2021

In an industrial field, non-destructive testing (NDT) is commonly used to inspect industrial products. Among NDT methods using radiation sources, X-ray laminography has several advantages, such as high depth resolution and low computational costs. Moreover, an X-ray laminography system with stationary source array and compact detector is able to reduce mechanical motion artifacts and improve inspection efficiency. However, this system, called stationary inverse-geometry X-ray laminography (s-IGXL), causes truncation artifacts in reconstructed images due to limited fields-of-view (FOVs). In this study, we proposed a projection data correction (PDC) method to reduce the truncation artifacts arisen in s-IGXL images, and the performance of the proposed method was evaluated with the different number of focal spots in terms of quantitative accuracy. Comparing with conventional techniques, the PDC method showed superior performance in reducing truncation artifacts and improved the quantitative accuracy of s-IGXL images for all the number of focal spots. In conclusion, the PDC method can improve the accuracy of s-IGXL images and allow precise NDT measurements.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.3
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• pp.353-362
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• 1999

This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.5
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• pp.558-567
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• 1999

X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promis to be good solutions for inspecting interior defects of industrial products. DT is a kind of laminography technique and the difference is in the fact that it synthesizes the several projected images by use of the digitized memory and computation. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria : (1) shape accuracy and (2) clearness of the cross-sectional images are defined. Based on these criteria, a series of simulations are performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum methods.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.264-267
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• 1996

This paper is aimed to develop a very reliable method for automatic inspection of the solder joints on PCBS. There have been lots of previous works using vision technologies, but they can not be used for inspecting BGA, FCA or other newly used devices. Thus we adopt X-ray technologies for solder joint inspection. We put our attention on reconstructing the 3D shapes of solder joints since it gives us the most detailed information on quality of solder joints. Laminography principle is used to reject the interferences from neighboring parts or leads. To verify the effectiveness of laminography, a simulation study is performed in the case of a solder joints on double sided PCB using.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.572-576
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• 1997

X-ray laminography and DT(digital tomosynthesis) that can form a cross-sectional image of 3-D objects promise to be good solutions for inspecting interior defects of industrial products. The major factors of the digital tomosynthesis that influence on the quality of x-ray cross-sectional images are also discussed. The quality of images acquired from the DT system varies according to image synthesizing methods, the number of images used in image synthesizing, and X-ray projection angles. In this paper, a new image synthesizing method named 'log-root method' is proposed to get clear and accurate cross-sectional images, which can reduce both artifact and blurring generated by materials out of focal plane. To evaluate the quality of cross-sectional images, two evaluating criteria: (1) shape accuracy and (2) clearness in the cross-sectional image are defined. Based on this criteria, a series of simulations were performed, and the results show the superiority of the new synthesizing method over the existing ones such as averaging and minimum method.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.109-112
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• 1996

The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.198-207
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• 1999

This paper presents an accurate algorithm for geometric calibration of X-ray imaging system. Calibration is a very important process for improving an imaging system performance. There has been a lot of previous works using linear camera modeling technique, where lens distortion is neglected and/or center of distortion is assumed to be known. Geometrical distortion of image intensifier, however, is very large and its center of distortion should be calculated. This paper presents a new calibration method to estimate the intensifier position and orientation, scale factor, distortion coefficient, magnification factor, and center of distortion using the least square method. We investigate the properties of the algorithm by computer simulation. Simulation results show that the parameters can be estimated accurately using the proposed algorithm.

• Journal of Institute of Control, Robotics and Systems
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• v.7 no.3
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• pp.246-254
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• 2001

In this paper, we described an approach to the automation of visual inspection of BGA solder joint defects of surface mounted components on printed circuit board by using neural network. Inherently, the BGA solder joints are located underneath its own package body, and this induces a difficulty of taking good image of the solder joints by using conventional imaging systems. To acquire the cross-sectional image of BGA sol-der joint, X-ray cross-sectional imaging method such as laminography and digital tomosynthesis has been cur-rently utilized. However, the cross-sectional image obtained by using laminography or DT methods, has inher-ent blurring effect and artifact. This problem has been a major obstacle to extract suitable features for classifi-cation. To solve this problem, a neural network based classification method is proposed int his paper. The per-formance of the proposed approach is tested on numerous samples of printed circuit boards and compared with that of human inspector. Experimental results reveal that the method provides satisfactory perform-ance and practical usefulness in BGA solder joint inspection.

• Journal of Chest Surgery
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• v.2 no.1
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• pp.65-72
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• 1969

Superior Vena Cava Syndrome: Dacron and Nylon graft between the left innominate vein and the right atrial appendage. Two cases with typical superior vena cave syndrome treated by by-pass graft between the left innominate vein and the right atrial apepndage were presented. One of them was a 58 year old farmer who suffered from marked swelling of the neck and upper half of body, the other was a 50 years old government employee who had acutely progressive symptoms of superior vena cave obstruction. Both of cases revealed that [1] cubitel venous pressure was markedly increased. [2] tumors were noted in the posterior mediastinum by laminography. [3] preoperative cavogram showed the occlusion of superior vena cava and marked collaterals. Dacron and Nylon graft were inserted between the left innominate vein and the right atrial appendage. Postoperatively, the symptoms were relieved markedly, showing edema free face and decreased cubital venous pressure. Postoperative cavogram showed patent graft. Histologically the first case was diagnosed as squamous cell carcinoma and the second as undifferentiated carcinoma, originated probably from bronchus. Total doses of 3150 r X-ray irradiation and 5000 mg of 5-FU were administered in each cases. The first case expired 11 months postoperatively without recurrence of superior vena cave obstruction symptom and the second case is living now without obstruction signs, 4 months after by-pass operation.