References
- Circuits Interconnections, and Packaging for VLSI H.B.Bakoglu
- International Conference on Physical Design Min-Cost Flow based Minimum-Cost Rectilinear Steiner Distance-Preserving Tree J.D.Cho
- Proc. IEEE Custom Integr. Circuits Conf. Crosstalk Minimum Layer Assignment J.D.Cho;S.Raje;M.Sarrafzadeh;M.Sriram;S.M.Kang
- Layer Assignment for High-Performance Multi-Chip Modules High Performance Design Automation for MCM and Packages K.Y.Chao;D.F.Wong;Jun-Dong Cho(Ed.);Paul D.Franzon(Co-Ed.)
- 63-Layer TCM Wiring with Three-Dimensional Crosstalk Constraints High Performance Design Automation for MCM and Packages H.H.Chen;C.K.wong;J.D.cho(Ed.);P.D.Franzon(Co-Ed.)
- MS Thesis, Univ. of Cincinnati Distributed placement and crosstalk driven router for multichip modules G.Devaraj
- Proc. 7th Int. Conf. on VLSI Design SAGA-A unification of genetic algorithm with simulated annealing and its application to macrocell placement H.Esbensen;P.Mazumder
- Proc. 19th Design Automation Conference Tools to aid in wiring rule generation for high speed inteconnects P.Franzon;S.Simovich(et al.)
- Algorithmic Graph Theory and Perfect Graph M.C.Golumbic
- IEEE Transactions on Computer Aided Design v.10 no.4 Distributed Genetic Algorithms for the Floorplan Design Problem J.P.Cohoon
- International Conference on Computer-Aided Design A Spacing Algorithm for Performance Enhancement and Crosstalk Reduction K.Chaudhary;A.Onozawa;E.Kuh
- Journal of Algorithms v.7 no.2 Single Bend Wiring R.Raghavan;J.Cohoon;S.Sahni
- An Overview of Placement and Routing Algorithms for Multi-Chip Modules High Performance Design Automation for MCM and Packages S.Chattopadhyay;D.Bouldin;P.Dehkordi;J.D.Cho(Ed.);P.D.Franzon(Co-Ed.)
- VLSI Placement and Global Routing Using Simulated Annealing C.Sechen
- Proc. IEEE Intl. Conf. on Wafer Scale Integration Performance Driven MCM Roution Using a Second Order RLC Tree Delay Model M.Sriram;S.M.Kang
- Physical Desig for Multichip Modules M.Sriram;S.M.Kang
- IEEE Transactions on Computer Aided Design v.9 no.5 A Genetic Approach to Standard Cell Placement Using Meta-genetic Parameter Optimization K.Shahookar;P.Mazumder
- Tech. Rep. A Vision for Multichip module design in the nineties Cadence-Design Systems
- appear in VLSI DESIGN, an international Journal of custom-Chip Design, Simulation, and Testing An Optimal Layer Assignment Algorithm for Minimizing Crosstalk for Three Layer VHV Channel Routing S.Thakur;K.Y.Chao;D.F.Wong;Jun Dong Cho(Guest Ed.)
- PhD thesis, Univ. of Cincinnati Genetic algorithms for partitioning placement and layer assignment for multichip modules R.Vemuri
- Design Automation Conference Minimal Delay Interconnect Design using Alphabetic Trees A.Vittal;M.Marek Sadowska
- IEEE Transaction on Computer Aided Design v.13 no.6 On Multiterminal Single Bend Wirability H.C.Yen