Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Estimate of package crack reliabilities on the various parameters using taguchi's method

다꾸찌방법을 사용한 여러변수들이 패키지균열에 미치는 신뢰도 평가

  • Kwon, Yong-Su (Dept.of Mechanical Engineering, Graduate School of Yeungnam University) ;
  • Park, Sang-Sun (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology) ;
  • Park, Jae-Wan (Dept.of Mechanical Engineering, Graduate School of Yeungnam University) ;
  • Chai, Young-Suck (Dept.of Mechanical Engineering, Yeungnam University) ;
  • Choi, Sung-Ryul (Dept.of Mechanical Engineering, Yeungnam University)
  • 권용수 (영남대학교 대학원 기계공학과) ;
  • 박상선 (한국과학기술원 기계공학과) ;
  • 박재완 (영남대학교 대학원 기계공학과) ;
  • 채영석 (영남대학교 기계공학부) ;
  • 최성렬 (영남대학교 기계공학부)
  • Published : 1997.06.01
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Abstract

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

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