DOI QR코드

DOI QR Code

Thermal optimization of the chip arrangement in the PCB channel using genetic algorithm

제네틱 알고리듬을 이용한 PCB 채널 내 칩배열의 열적 최적화

  • 백창인 (한양대학교 대학원 기계공학과) ;
  • 이관수 (한양대학교 기계공학과) ;
  • 김우승 (한양대학교 기계공학과)
  • Published : 1997.03.01

Abstract

A thermal optimization of the chip arrangement in the PCB channel oriented vertically and cooled by natural convection has been studied. The objective of this study is to find the chip arrangement that minimizes the maximum temperature of the entire PCB channel. SIMPLER algorithm is employed in the analysis, and the genetic algorithm is used for the optimization. The results show that the chip with a maximum volumetric heat generation rate has to be located at the bottom of the channel, and chips with relatively high heat generation rates should not be close to each other, and small chip should not be located between the large chips.

Keywords

References

  1. Materials & Design v.12 no.1 Furuya, Y.;Hishinada
  2. 日本工業材料 v.31 no.1 TiNi 形狀記億合金のSME サイクルによる機械的性質への影響 關口行雄
  3. Proceedings of the International Conference on Martensitic Transformations Production and Shape Memory Effect of Nickel-Titan Ehrenstein H.
  4. Screpta Metallurgica v.19 The Investigation of Internal Friction Electric Resistance and Shape Change in NiTi Alloy During Phase Transformations Yuanti Huang;Gueping Yang;Ping He
  5. 日本金屬學會報 v.19 no.5 形狀記億合金の應用 Wayman, C. M.
  6. 한국해양공학회지 v.6 no.11 형상기억합금의 반복변형특성과 피로현상에 관한 연구 박영철;오세욱;조용배;허정원;이명열
  7. 日本機械學會論文集(A)篇 v.56 no.521 Ti-Ni 合金の反復し 變態の彈性特性 川口捻;大橋義夫;戶伏壽昭
  8. 日本金屬學會誌 v.50 no.6 豫荷重試驗によるTiNi合金の應力有期變態 田村裕一
  9. Engineering Aspects of Shape Memory Alloys Wayman, C. M.;Duering, T. W.