E2M - 전기 전자와 첨단 소재 (Electrical & Electronic Materials)
- 제8권3호
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- Pages.340-351
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- 1995
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- 2982-6268(pISSN)
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- 2982-6306(eISSN)
표시소자 응용을 위한 copper, aluminum 박막의 성장과 특성
Copper, aluminum based metallization for display applications
초록
Electrical, physical and optical properties of Aluminum(Al), Copper(Cu) thin films were investigated in order to establish the optimum sputtering parameters in Liquid Crystal Display (LCD) panel applications. DC-magnetron sputtered film on coming 7059 samples were fabricated with variations of deposition power densities, deposition pressures and substrate temperatures. Low resistivity films(AI;2.80 .mu..ohm.-cm, Cu:1.84 .mu..ohm-cm),which lower than the reported values, were obtained under sputtering parameters of power density(250W), substrate temperature(450-530.deg. C) and 5*10
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