참고문헌
- Volumes 89-91 of Key Engineering Materials Application of Silicon Nitride P.Popper;M.J.Hoffman(ed.);P.F.Becher(ed.);G.Petzow(ed.)
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J. Eur. Ceram. Soc.
v.9
Developement and Characterization of Electroconductive
$Si_{3}N_{4}-TiN$ Composites A.Bellosi;S.Guicciardi;A.Tampieri - Mat. Sci. Eng. v.A109 Electrical Discharge Machinable Ceramic Composites C.Martin;B.Cales;P.Vivier;P.Mathieu
- Sumitomo Electr. Tech. Rev. v.24 Electrical Discharge Machinable Si₃N₄Ceramics E.Kajimo;M.Honda;M.Higuchi;H.Takeuchi;T.Tanimura
- J. Ceram. Soc. Jpn. v.12 Electrical Discharge Machining of Si₃N₄-SiC Whisker Composites N.Tanari;T.Kondo;K.Keno;Y.Toibana
- J. Mater. Sci. v.12 Equilibrium Penny-Like Cracks in Indentation Fracture B.R.Lawn;E.R.Fuller
- Mat. Res. Symp. Proc. v.287 Microstructure Design by Selective Grain Growth of Si₃N₄ N.Hirosaki;Y.Akimine;M.Mitomo
- J. Am. Ceram. Soc. v.75 no.1 Microstructure Development During Gas-Pressure Sintering of Silicon Nitride M.Mitomo;S.Uenosono
- Mat. Res. Symp. Proc. v.287 High-Resolution Electron Microscopy Observations of Grain-Boundary Films in Silicon Nitride Ceramics H.J.Kleebe;M.K.Cinibulk;I.Tanaka;J.Bruley;R.M.Cannon;D.R.Clarke;M.J.Hoffman;M.Ruhle
- J. Am. Ceram. Soc. v.63 no.9-10 The Role of Grain-Boundary Sliding in Fracture of Hot-Pressed Si₃N₄at High Temperatures R.S.Tsai;R.Raj
- J. Eur. Ceram. Soc. v.10 SiC and Si₃N₄Materials with Improved Fracture Resistance H.J.Kleebe
- J. Mat. Sci. v.28 Creep of Silicon Nitride-Titanium Nitride Composites Y.G.Gogotsi;G.Grathwohl
- Fracture of Brittle Solids B.Lawn
- J. Kor. Ceram. Soc. v.26 no.3 Mechanical Properties of the Presureless Sintered Si₃N₄-TiN Ceramic Composites J.S.Song;Y.B.Son;C.H.Kim
- Engineering Materials v.32 no.11 Electrical Discharge Machinable Si₃N₄Ceramics H.Takeuchi;E.Kamizo