References
- IMC (1994) Proceedings 0.3mm QFP Mounting Technology Tadahiko Sakai(et al.)
- IMC (1992) Proceedings New Soldering Technology for Mounting Components Handles 0.15mm Pitch Components Kenichi Fuse(et al.)
- IMC (1992) Proceedings Printability of Solder Paste with 0.3mm Pitch Haruo Mishina(et al.)