재산화된 질화 산화막을 게이트 절연막으로 사용한 MOSFET의 특성

The Characteristics of MOSFET with Reoxidized Nitrided Oxide Gate Dielectrics

  • 양광선 (연세대학교 전자공학과) ;
  • 박훈수 (연세대학교 전자공학과) ;
  • 김봉렬 (연세대학교 전자공학과)
  • 발행 : 1991.09.01

초록

N$^{+}$poly gate NMOSFETs and p$^{+}$ poly gate (surface type) PMOSFETs with three different gate oxides(SiO2, NO, and ONO) were fabricated. The rapid thermal nitridation and reoxidation techniques have been applied to gate oxide formation. The current drivability of the ONO NMOSFET shows larger values than that of the SiO2 NMOSFET. The snap-back occurs at a lower drain voltage for SiO$_2$ cases for ONO NMOSFET. Under the maximum substrate current bias conditions, hot-carrier effects inducting threshold voltage shift and transconductance degradation were investigated. The results indicate that ONO films exhibit less degradation in terms of threshold voltage shift. It was confirmed that the ONO samples achieve good improvement of hot-carrier immunity. In a SiO$_2$ SC-PMOSFET, with significant boron penetration, it becomes a depletion type (normally-on). But ONO films show excellent impurity barrier properties to boron penetration from the gate.

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