Journal of the Korean Institute of Telematics and Electronics (대한전자공학회논문지)
- Volume 27 Issue 10
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- Pages.96-100
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- 1990
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- 1016-135X(pISSN)
Adhesion Properties of Cu/cordierite for Multilayer IC Packaging
다층 IC펙키지용 구리/코디에라이트 접합 특성
- Han, Byeung-Sung (Dept. of Electrical Eng., Chonbuk Univ.) ;
- Yu, Sung-Tae (Dept. of Electrical Eng., Chonbuk Univ.) ;
- Lim, Nam-Hi (Dept. of Electrical Eng., Chonbuk Univ.) ;
- Jang, Me-Hea (Dept. of Electrical Eng., Chonbuk Univ.) ;
- Park, Sung-Jin (Dept. of Electrical Eng., Chonbuk Univ.)
- Published : 1990.10.01
Abstract
The cordierite (
코디에라이트(
Keywords