Studies on the Electrical Resistance and the Behaviors of Excess Silicon of Tungsten Silicide during Oxidation

텅스텐 실리사이드의 산화에 따른 전기저항 및 과잉실리콘의 거동에 관한 연구

  • Published : 1990.05.01

Abstract

Effects of excess Si on the properities of the oxide of CVD tungsten silicide were investigated by comparing the characteristics of the two kinds of thermal oxide for CVD-WSi2.7 and WSi3.1 films on the polycrystalline Si film each other. It is reveraled from AES analysis that Si in the surface region of the silicide film is consumed to make composition and resistivity of the silicide film very nonuniform for the case of the oxidation of WSi3.1, while the underlayer polycrystalline Si was consumed for the case of the oxidation of WSi2.7.

Keywords

References

  1. IEEE Trans.Electrom Device v.ED-29 Effect of Scaling of Interconnections on the Time Delay of VLSI Circuits K.C. Saraswat;Mohamad
  2. IEEE Trans. Electron Devices v.ED-26 The Evolution of Digital Electronics Toward VLSI R.W. Keyes
  3. Semiconductor International Pieter Burggraaf
  4. Personal Communications S.H. Hong
  5. J. Appl. Phys. v.58 no.2 Secondary Grain Growth in Thin Films of Semiconductors : Theoretical Aspects C.V. Thomson
  6. J. Appl. Phys. v.0 no.1 Analysis of the Effects of Annealing on Resistivity of Chemical Vapor Deposition Tungsten Silicide Films Yoshimi Shioya
  7. J. Appl. Phys. v.52 no.8 Properties of Tungsten Silicide Film on Polycrystalline Silicon M.Y. Tasi;F.M. d'Heurle;C.S. Petersson;R.W. Johnson
  8. J. Appl. Phys. v.62 no.7 Annealing and Oxidation Behavior of Low-Pressure CVD Tungsten Silicide Layers on Poly-Si Gate D.K. Sadana;A.E. Morgan;M.H. Norcott;S. Naik
  9. J. Electrochem. Soc. v.129 no.10 Thermal Oxidation of Heavily Phosphorus Doped Thin Films of Poly crystalline Silicon K.C. Saraswat;H. Singh
  10. J. Appl. Phys. v.54 Interface Effects in the Formation of Silicon Oxide on Metal Silicide Layers over Silicon Substrates J.E. Baglin;F.M. d'Heurle;C.S. Petersson