Influence of Ion Beam Etching on Silicon Schottky Barriers

실리콘 숏키장벽의 이온선 에칭의 영향

  • Published : 1986.02.01

Abstract

Ion beam etching of silicon with N2 and Ar gas has been found to cause the band edge to bend downward near the surface in p-type silicon. Rectifying, rather than ohmic contacts are obtained on the structures formed by evaporation of gold and titanium onto ion-bean-etched p-type silicon. The 1/C2 versus V relationship measured at 1MHz is found to be nonlinear for small voltages indicating alteration of the effective doping colse to the silicon surface.

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