Korean Journal of Food Science and Technology (한국식품과학회지)

Korean Society of Food Science and Technology (한국식품과학회)
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Effect of Heat-Moisture Treatments on Physico-Chemical Properties of Chestnut Starch

수분-열처리에 의한 밤전분의 물리화학적 성질의 변화

  • Park, Hong-Hyun (Department of Food and Nutrition, International College of Hotel Administration, Kyung Hee University) ;
  • Lee, Kyu-Han (Department of Food Science and Nutrition, Dankook University) ;
  • Kim, Sung-Kon (Department of Food Science and Nutrition, Dankook University)
  • 박홍현 (경희호텔 경영전문대학 식품영양과) ;
  • 이규한 (단국대학교 식품영양학과) ;
  • 김성곤 (단국대학교 식품영양학과)
  • Published : 1986.12.01
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Abstract

Physicochemical properties of chestnut starch, which was adjusted at 14, 18, 21 and 24% moisture and heated for 16 hr at $100^{\circ}C$, were investigated. The cystallinity, swelling power and solubility of the starch were decreased upon heat-moisture treatments. The swelling power of the heat-moisture treated starch showed an inverse relation with moisture levels, while the solubility showed opposite trend. The swelling power and the solubility of both raw and heat-moisture treated starches held a liner relationship. The. water binding capacity of the starch was drastically increased upon heat-moisture treatments. Amylograms revealed that the heat-moisture treated starches had higher initial pasting temperature and lower viscosity than untreated starch. No peak viscosity was observed for the heat treated starches above 21% moisture. The minimum moisture contents for gelatinization of raw and heat-moisture (18%) treated starches were 45 and 40%, respectively. The gelatinization temperature of raw and heat-moisture (18%) treated starches was $65^{\circ}C$.

밤전분의 수분을 14,18,21 및 24%로 조절하고 $100^{\circ}C$에서 16시간 가열 처리한 다음 이화학적 성질을 생전분과 비교하였다. 수분-열처리에 따라 결정도, 팽화력 및 용해도는 다같이 감소하였다. 전분현탁액(0.1%)의 광투과도는 $58^{\circ}C$부터 급격히 증가하였으나 수분 (18%) 열처리한 전분은 $63^{\circ}C$부터 광투과도가 증가하였으며 그 증가율은 비처리 전분에 비하여 낮았다. 전분의 호화양상은 수분-열처리에 의하여 초기호화온도는 증가하였고 수분 21%이상 처리한 전분은 최고 점도를 보이지 않았다. 전분의 호화에 필요한 최저수분함량은 생전분이 45%, 수분(18%)-열처리한 전분이 40%이었으며. 호화에 필요한 최저 온도는 모두 $65^{\circ}C$이었다.

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