Proceedings of the Korean Vacuum Society Conference (한국진공학회:학술대회논문집)
- 2013.02a
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- Pages.323-323
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- 2013
Influence of Bath Temperature on Electroless Ni-B Film Deposition on PCB for High Power LED Packaging
- Samuel, Tweneboah-Koduah (Department of Information and Communications Engineering, Hanbat National University) ;
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Jo, Yang-Rae
(Department of Information and Communications Engineering, Hanbat National University) ;
- Yoon, Jae-Sik (Department of Information and Communications Engineering, Hanbat National University) ;
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Lee, Youn-Seoung
(Department of Information and Communications Engineering, Hanbat National University) ;
- Kim, Hyung-Chul (Department of Materials Engineering, Hanbat National University) ;
- Rha, Sa-Kyun (Department of Materials Engineering, Hanbat National University)
- Published : 2013.02.18
Abstract
High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from
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