Proceedings of the Korean Vacuum Society Conference (한국진공학회:학술대회논문집)
- 2013.02a
- /
- Pages.320-320
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- 2013
Real-Time Small Exposed Area $SiO_2$ Films Thickness Monitoring in Plasma Etching Using Plasma Impedance Monitoring with Modified Principal Component Analysis
- Published : 2013.02.18
Abstract
Film thickness monitoring with plasma impedance monitoring (PIM) is demonstrated for small area
Keywords
- Plasma etching;
- Film thickness monitoring;
- Principal component analysis;
- Plasma impedance monitoring