한국진공학회:학술대회논문집 (Proceedings of the Korean Vacuum Society Conference)
- 한국진공학회 2009년도 제38회 동계학술대회 초록집
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- Pages.458-458
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- 2010
Role of $N_2$ flow rate on etch characteristics and variation of line edge roughness during etching of silicon nitride with extreme ultra-violet resist pattern in dual-frequency $CH_2F_2/N_2$ /Ar capacitively coupled plasmas
- 발행 : 2010.02.17
초록
The process window for the etch selectivity of silicon nitride (
키워드