한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)

한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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도금 및 CMP에 의한 Micro-Tip 제작 공정 연구

A Study on Micro-Tip Fabrication by Plating and CMP

  • Han, Myung-Soo (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Park, Chang-Mo (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Shin, Gwang-Soo (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Ko, Hang-Ju (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Kim, Doo-Gun (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Hann, S-Wook (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Kim, Seon-Hoon (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Ki, Hyun-Chul (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Kim, Hyo-Jin (Photonics Device Team, Korea Photonics Technology Institute) ;
  • Kim, Jang-Hyun (JML Co.)
  • 발행 : 2009.06.18
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초록

We investigate micro-tip properties as Ni-Co plating and CMP processes for MEMS probe card and units. The micro-tip are fabricated by using Ni-Co plating machine, lapping machine, and chemo-mechanical polisher. In order to get high conductive and reliable micro-tip, we control Co contents and thickness by CMP speed. We have found that about 20-25% of Co contents are required and have to lapping speed of 30 rpm. Also, we investigate photolithography and Ni-Co plating processes conditions for the one-step and the three-step micro-tips.

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