Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

The Analysis of Thermal Movement and Structural Function in High-power LED

고출력 LED의 구조함수분석과 열 거동현상 분석

  • Published : 2009.07.14
Download PDF
⟨ Previous Next ⟩

Abstract

In this paper, thermal movement of high power LED on the MCPCB is analyzed with structural function and CFdesign V10 program. thermal resistance is decreased as 10.1 [$^{\circ}C$/W] in MCPCB from 12.2 [$^{\circ}C$/W] in LED package. Junction temperature which is calculated with thermal computational analysis program shows 85.113 [$^{\circ}C$] and almost same to measured data.

Keywords