대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)
- 대한전자공학회 2008년도 하계종합학술대회
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- Pages.515-516
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- 2008
COG Module 공정에서의 Glass 휨 연구
Investigation for warpage in the COG Module process
- Kim, Byoung-Yong (School of Electrical and Electronic Engineering Yonsei University) ;
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Seo, Dae-Shik
(School of Electrical and Electronic Engineering Yonsei University)
- 발행 : 2008.06.18
초록
We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG in the PAD party is decreased.
키워드