Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2008.06a
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- Pages.511-512
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- 2008
Fabrication of PDMS micro-pads for vibration absorber in MEMS packaging
MEMS packaging을 위한 Micro PDMS pad 제작
- Kim, Han-Hyoung (Department of Information Engineering, Inha University) ;
- Sim, Se-Hwan (Department of Information Engineering, Inha University) ;
- Kim, Sung-Gi (Department of Information Engineering, Inha University) ;
- Yang, Seung-Kook (Department of Information Engineering, Inha University) ;
- O, Beom-Hoan (Department of Information Engineering, Inha University) ;
- Lee, Seung-Gol (Department of Information Engineering, Inha University) ;
- Lee, El-Hang (Department of Information Engineering, Inha University) ;
- Park, Se-Geun (Department of Information Engineering, Inha University) ;
- Lee, Jong-Geun (Digital & Industrial Electron Engineering, Bucheon College)
- 김한형 (인하대학교 정보공학과) ;
- 심세환 (인하대학교 정보공학과) ;
- 김성기 (인하대학교 정보공학과) ;
- 양승국 (인하대학교 정보공학과) ;
- 오범환 (인하대학교 정보공학과) ;
- 이승걸 (인하대학교 정보공학과) ;
- 이일항 (인하대학교 정보공학과) ;
- 박세근 (인하대학교 정보공학과) ;
- 이종근 (부천대학, 디지털 산업 전자공학과)
- Published : 2008.06.18
Abstract
Micro-pads made of PDMS(polydimethylsiloane) can be mechanical shock or vibration absorber because of its contractibility. Fabrication of micro-pads and techniques of separation from substrate and attachment to new substrate are developed. Three micron thick PDMS pads were fabricated by imprinting lithography.
Keywords