대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)

대한전자공학회 (The Institute of Electronics and Information Engineers)
권호 표지

MEMS packaging을 위한 Micro PDMS pad 제작

Fabrication of PDMS micro-pads for vibration absorber in MEMS packaging

  • 김한형 (인하대학교 정보공학과) ;
  • 심세환 (인하대학교 정보공학과) ;
  • 김성기 (인하대학교 정보공학과) ;
  • 양승국 (인하대학교 정보공학과) ;
  • 오범환 (인하대학교 정보공학과) ;
  • 이승걸 (인하대학교 정보공학과) ;
  • 이일항 (인하대학교 정보공학과) ;
  • 박세근 (인하대학교 정보공학과) ;
  • 이종근 (부천대학, 디지털 산업 전자공학과)
  • Kim, Han-Hyoung (Department of Information Engineering, Inha University) ;
  • Sim, Se-Hwan (Department of Information Engineering, Inha University) ;
  • Kim, Sung-Gi (Department of Information Engineering, Inha University) ;
  • Yang, Seung-Kook (Department of Information Engineering, Inha University) ;
  • O, Beom-Hoan (Department of Information Engineering, Inha University) ;
  • Lee, Seung-Gol (Department of Information Engineering, Inha University) ;
  • Lee, El-Hang (Department of Information Engineering, Inha University) ;
  • Park, Se-Geun (Department of Information Engineering, Inha University) ;
  • Lee, Jong-Geun (Digital & Industrial Electron Engineering, Bucheon College)
  • 발행 : 2008.06.18
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Micro-pads made of PDMS(polydimethylsiloane) can be mechanical shock or vibration absorber because of its contractibility. Fabrication of micro-pads and techniques of separation from substrate and attachment to new substrate are developed. Three micron thick PDMS pads were fabricated by imprinting lithography.

키워드