대한전자공학회:학술대회논문집 (Proceedings of the IEEK Conference)

대한전자공학회 (The Institute of Electronics and Information Engineers)
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Dry Film Resist를 이용한 RF MEMS 소자의 기판단위 실장에 대한 연구

A Study on Wafer-Level Package of RF MEMS Devices Using Dry Film Resist

  • 강성찬 (서울대학교 전기컴퓨터공학부) ;
  • 김현철 (울산대학교 전기전자정보시스템공학부) ;
  • 전국진 (서울대학교 전기컴퓨터공학부)
  • Kang, Sung-Chan (School of Electrical Engineering and Computer Sciences Seoul National University) ;
  • Kim, Hyeon-Cheol (School of Electrical Engineering Ulsan University) ;
  • Chun, Kuk-Jin (School of Electrical Engineering and Computer Sciences Seoul National University)
  • 발행 : 2008.06.18
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초록

This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

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