Etching characteristics of ArF and EUV resists in dual-frequency superimposed capacitively coupled $CF_4/O_2$/Ar and $CF_4/CHF_3/O_2$/Ar plasmas

  • Gwon, Bong-Su (Department of Advanced Materials Science and Engineering and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) ;
  • Park, Yeong-Rok (Department of Advanced Materials Science and Engineering and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) ;
  • Kim, Jin-Seong (Department of Advanced Materials Science and Engineering and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) ;
  • An, Jeong-Ho (Department of Advanced Materials Science and Engineering and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) ;
  • Lee, Nae-Eung (Department of Advanced Materials Science and Engineering and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) ;
  • Lee, Seong-Gwon (Research & Development Division, Hynix Semiconductor) ;
  • Park, Seong-Uk (Research & Development Division, Hynix Semiconductor)
  • Published : 2008.08.20