한국소성가공학회:학술대회논문집 (Proceedings of the Korean Society for Technology of Plasticity Conference)

한국소성∙가공학회 (The Korean Society for Technology of Plasticity and materials processing)
권호 표지

전화기 케이스 외관의 Weldline 제거를 위한 금형 급속 가열-냉각 기술 개발

Development of rapid mold heating & cooling technology to remove weldline on surface appearance in telephone case

  • 차백순 (한국생산기술연구원 정밀금형팀) ;
  • 박형필 (한국생산기술연구원 정밀금형팀) ;
  • 이상용 (한국생산기술연구원 정밀금형팀) ;
  • 김옥래 (한국생산기술연구원 정밀금형팀) ;
  • 이승욱 (엔지니어스랩) ;
  • 이병옥 (엔지니어스랩)
  • 발행 : 2008.10.09
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초록

Painting process or coating with acrylic film may improve the surface defects of injection molded parts deteriorated by weldlines. flow marks. and etc. However such processes increase the production costs and increase environmental problems. Recently various types of rapid mold heating & cooling technology have been developed in order to improve surface quality of products. In this study. the heating & cooling performance of a telephone case mold is investigated by heat transfer analysis, in which the rapid mold heating & reeling technology is applied. The surface temperature of the mold was measured using thermal image camera and compared with analysis results. The influence of the rapid mold heating & cooling technology on weldline appearance and cycle time increase was also examined.

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