한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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- Pages.415-416
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- 2008
플립칩 본딩 구조의 표면방출레이저 어레이에 대한 열 해석
Thermal analysis of a VCSEL array with flip-chip bond design
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김선훈
(한국광기술원) ;
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김태언
(한국광기술원) ;
- 김상택 (한국광기술원) ;
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기현철
(한국광기술원) ;
- 양명학 (한국광기술원) ;
- 김효진 (한국광기술원) ;
-
고항주
(한국광기술원) ;
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김회종
(한국광기술원)
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Kim, Seon-Hoon
(Korea Photonics Technology Institute) ;
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Kim, Tae-Un
(Korea Photonics Technology Institute) ;
- Kim, Sang-Taek (Korea Photonics Technology Institute) ;
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Ki, Hyun-Chul
(Korea Photonics Technology Institute) ;
- Yang, Myung-Hak (Korea Photonics Technology Institute) ;
- Kim, Hyo-Jin (Korea Photonics Technology Institute) ;
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Ko, Hang-Ju
(Korea Photonics Technology Institute) ;
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Kim, Hwe-Jong
(Korea Photonics Technology Institute)
- 발행 : 2008.06.19
초록
The finite element model was used to simulate the temperature distribution of a arrayed vertical-cavity surface-emitting laser (VCSEL). In this work, the dimension of AlGaAs/GaAs based VCSEL array was