Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2007.06a
- /
- Pages.502-502
- /
- 2007
Investigation of Conductive Pattern Line for Direct Digital Printing
디지털 프린팅을 위한 전도성 배선에 관한 연구
- Kim, Yong-Sik (Central R&D Institute, Samsung Electro-Mechanics) ;
- Seo, Shang-Hoon (Central R&D Institute, Samsung Electro-Mechanics) ;
- Lee, Ro-Woon (Central R&D Institute, Samsung Electro-Mechanics) ;
- Kim, Tae-Hoon (Central R&D Institute, Samsung Electro-Mechanics) ;
- Park, Jae-Chan (Central R&D Institute, Samsung Electro-Mechanics) ;
- Kim, Tae-Gu (Central R&D Institute, Samsung Electro-Mechanics) ;
- Jeong, Kyoung-Jin (Central R&D Institute, Samsung Electro-Mechanics) ;
- Yun, Kwan-Soo (Central R&D Institute, Samsung Electro-Mechanics) ;
- Park, Sung-Jun (Central R&D Institute, Samsung Electro-Mechanics) ;
- Joung, Jae-Woo (Central R&D Institute, Samsung Electro-Mechanics)
- 김용식 (삼성전기 중앙연구소) ;
- 서상훈 (삼성전기 중앙연구소) ;
- 이로운 (삼성전기 중앙연구소) ;
- 김태훈 (삼성전기 중앙연구소) ;
- 박재찬 (삼성전기 중앙연구소) ;
- 김태구 (삼성전기 중앙연구소) ;
- 정경진 (삼성전기 중앙연구소) ;
- 윤관수 (삼성전기 중앙연구소) ;
- 박성준 (삼성전기 중앙연구소) ;
- 정재우 (삼성전기 중앙연구소)
- Published : 2007.06.21
Abstract
Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.