Bare-ware inspection method using knife-edge optical test

칼날 측정법을 이용한 베어 웨이퍼 검사 방법

We present a new simple and fast bare-wafer inspection method. This method inspects the wafer front surface and inner structures simultaneously. The wafer surface is inspected using a knife-edge test in visible while the inner structure is inspected by a looking-through camera in infrared, at the same time and with a single white-light source. This paper presents a laboratory implementation of the test method with some experimental results.