Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Hermeticity and Reliability Issues in Microsystems Packaging

  • Ham, Suk-Jin (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology) ;
  • Kim, Woon-Bae (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology) ;
  • Moon, Chang-Youl (Packaging Project Team Micro Devices and Systems Lab. Samsung Advanced Institute of Technology)
  • Published : 2007.04.04
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Abstract

[ ${\square}$ ] A mathematical model has been developed and used to analyze the limits of He fine leak test. ${\square}$ Uncertainties inherent in using the MIL-STD-883 guidelines for hermeticity evaluation of small packages have been demonstrated. ${\square}$ A new methodology to quantitatively characterize hermeticity has been developed.

Keywords