대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
- /
- Pages.148-149
- /
- 2007
웨이퍼 레벨 공정이 가능한 2축 수직 콤 구동 방식 마이크로미러
Wafer-Level Fabrication of a Two-Axis Micromirror Driven by the Vertical Comb Drive
- 김민수 (서울대학교 전기공학부) ;
- 유병욱 (서울대학교 전기공학부) ;
- 진주영 (서울대학교 전기공학부) ;
-
전진아
(이화여자대학교 물리학과) ;
- ;
- 박재형 (이화여자대학교 물리학과) ;
-
김용권
(서울대학교 전기공학부)
- Kim, Min-Soo (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Yoo, Byung-Wook (School of Electrical Engineering and Computer Science, Seoul National University) ;
- Jin, Joo-Young (School of Electrical Engineering and Computer Science, Seoul National University) ;
-
Jeon, Jin-A
(Research Center of MEMS Space Telescope, Ewha Womans University) ;
-
Park, Il-Heung
(Research Center of MEMS Space Telescope, Ewha Womans University) ;
- Park, Jae-Hyoung (Research Center of MEMS Space Telescope, Ewha Womans University) ;
-
Kim, Yong-Kweon
(School of Electrical Engineering and Computer Science, Seoul National University)
- 발행 : 2007.11.02
초록
We present the design and fabrication prcoess of a two-axis tilting micromirror device driven by the electrostatic vertical comb actuator. A high aspect-ratio comb actuator is fabricated by multiple DRIE process in order to achieve large scan angle. The proposed fabrication process enables a mirror to be fabricated on the wafer-scale. By bonding a double-side polished (DSP) wafer and a silicon-on-insulator (SOI) wafer together, all actuators on the wafer are completely hidden under the reflectors. Nickel lines are embedded on a Pyrex wafer for the electrical access to numerous electrodes of mirrors. An anodic bonding step is implemented to contact electrical lines with ail electrodes on the wafer at a time. The mechanical angle of a fabricated mirror has been measured to be 1.9 degree and 1.6 degree, respectively, in the two orthogonal axes under driving voltages of 100 V. Also, a
키워드