Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)
- 2006.06a
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- Pages.487-488
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- 2006
The Characteristics of operating noises in the FBGA packages at high frequency
DRAM 패키지의 고주파 잡음 특성
- Kim, Joon-Il (Department of Electronic Engineering, Sogang University) ;
- Jee, Yong (Department of Electronic Engineering, Sogang University)
- Published : 2006.06.21
Abstract
In this paper, we analyzed the FBGA packages operating in high speeds and high frequency rates for DRAM. Using 3D simulations, we could extract s-parameters of packages. We realize that the proposed FBGA package does not operate properly at 3Gbps bacause the FBGA package have delta-I noise(
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