Numerical Analysis of Fusible Filler Behavior for Self-Interconnection Process

자기 접속 프로세스에 대한 볼륨 입자 거동에 대한 수치해석 연구

The present article aims to develop a numerical method for numerical analysis of fusible filler behavior for self-interconnection process. The CIP(Cubic Interpolated Propagation) method is used for determination of interfaces and the CSF(Continuum Surface Force) model is adopted for evaluation of curvature. To validate these models, first, the present study performs the numerical simulation for a droplet formation and it simulates the interactions among fusible fillers inside resin under the operating condition. As a result, similar tendency is found compared to the experimental observation. This study would be a first step towards finding the optimum condition for self-interconnection process.