레이저를 이용한 웨이퍼 다이싱 특성 분석

  • 이용현 (강남대학교 전자시스템정보공학부) ;
  • 최경진 (강남대학교 전자시스템정보공학부) ;
  • 유승렬 (한국기술교육대학교 기계정보공학부) ;
  • 양영진 (강남대학교 전자시스템정보공학부) ;
  • 배성창 (강남대학교 전자시스템정보공학부)
  • 발행 : 2006.05.01

초록

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

키워드