한국반도체및디스플레이장비학회:학술대회논문집 (Proceedings of the Korean Society Of Semiconductor Equipment Technology)
- 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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- Pages.156-159
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- 2006
박막두께 예측을 위한 증착 공정 모델링에 관한 연구
Study on Evaporating Process Modeling for Estimation of Thin-film Thickness Distribution
- 발행 : 2006.05.01
초록
In order to design an evaporation system, geometric simulation of film thickness distribution profile is required. In this paper, a geometric modeling algorithm is introduced for process simulation of the evaporating process. The physical fact of the evaporating process is modeled mathematically. Based on the developed method, the thickness of the thin-film layer can be successfully controlled.
키워드