한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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- Pages.378-379
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- 2006
새로운 연마제를 이용한 Oxide CMP 특성에 관한 연구
A study on the Oxide CMP Characteristics using New Abrasive
- 한성민 (대불대학교 전기전자공학과) ;
- 한상준 (대불대학교 전기전자공학과) ;
- 박성우 (대불대학교 전기전자공학과) ;
- 이우선 (조선대학교 전기공학과) ;
- 서용진 (대불대학교 전기전자공학과)
- Han, Sung-Min (Daebul University) ;
- Han, Sang-Jun (Daebul University) ;
- Park, Sung-Woo (Daebul University) ;
- Lee, Woo-Sun (Chosun University) ;
- Seo, Yong-Jin (Daebul University)
- 발행 : 2006.11.09
초록
CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper,