Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Precise composition control of Sn-3.0Ag-0.5Cu lead free solder bumping made by two binary electroplating

이원계 전해도금법에 의한 Sn-3.0Ag-0.5Cu 무연솔더 범핑의 정밀 조성제어

  • 이세형 (한국생산기술연구원 생산기반기술본부 정밀접합팀) ;
  • 이창우 (한국생산기술연구원 생산기반기술본부 정밀접합팀) ;
  • 강남현 (한국생산기술연구원 생산기반기술본부 정밀접합팀) ;
  • 김준기 (한국생산기술연구원 생산기반기술본부 정밀접합팀) ;
  • 김정한 (한국생산기술연구원 생산기반기술본부 정밀접합팀)
  • Published : 2006.05.01
Download PDF
⟨ Previous Next ⟩

Abstract

Sn-3.0Ag-0.5Cu solder is widely used as micro-joining materials of flip chip package(FCP) because of the fact that it causes less dissolution and has good thermal fatigue property. However, compared with ternary electroplating in the manufacturing process, binary electroplating is still used in industrial field because of easy to make plating solution and composition control. The objective of this research is to fabricate Sn-3.0Ag-0.5Cu solder bumping having accurate composition. The ternary Sn-3.0Ag-0.5Cu solder bumping could be made on a Cu pad by sequent binary electroplating of Sn-Cu and Sn-Ag. Composition of the solder was estimated by EDS and ICP-OES. The thickness of the bump was measured using SEM and the microstructure of intermetallic-compounds(IMCs) was observed by SEM and EDS. From the results, contents of Ag and CU found to be at $2.7{\pm}0.3wt%\;and\;0.4{\pm}0.1wt%$, respectively.

Keywords