Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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Reliability of BGA Package with OSP Surface Finish under Thermal Cycle

Thermal cycle하에서의 OSP 표면 처리된 BGA 패키지의 신뢰성 연구

  • 이종범 (성균관대학교 신소재공학부) ;
  • 노보인 (성균관대학교 신소재공학부) ;
  • 이영호 (성균관대학교 신소재공학부) ;
  • 정승부 (성균관대학교 신소재공학부)
  • Published : 2006.05.01
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Abstract

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

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