Proceedings of the Korean Powder Metallurgy Institute Conference (한국분말야금학회:학술대회논문집)
- 2006.09a
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- Pages.315-316
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- 2006
Electronics Cooling Using the Porous Metallic Materials
- Lucaci, Mariana (INCDIE ICPE-CA Bucharest) ;
- Orban, Radu L. (Technical University of Cluj Napoca) ;
- Lungu, Magdalena (INCDIE ICPE-CA Bucharest) ;
- Enescu, Elena (INCDIE ICPE-CA Bucharest) ;
- Gavriliu, Stefania (INCDIE ICPE-CA Bucharest)
- Published : 2006.09.24
Abstract
The paper presents some results regarding the obtaining of some copper heat pipes with a porous copper internal layer for electronic components cooling. The heat pipes were realized by sintering of spherical copper powders of