한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2006년도 추계학술대회 논문집
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- Pages.645-646
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- 2006
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- 2005-8446(pISSN)
CCM용 플립칩 본딩을 위한 초음파 본딩 기술 개발
Ultrasonic Flip-chip Bonding Technique for Compact Camera Module
- Kim, K.S. (Dept. of Mechanical Engineering, Korea Polytechnic University) ;
- Joung, S.W. (Dept. of Mechanical Engineering, Korea Polytechnic University) ;
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Yun, W.S.
(Dept. of Mechanical Engineering, Korea Polytechnic University)
- 발행 : 2006.10.18