한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
권호 표지

RF Packaging and Mobile SiP Technology

  • 발행 : 2006.10.11
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

[ $\blacksquare$ ] Mega Trends $\blacksquare$ Ceramic Based Module -> PCB Based SiP $\blacksquare$ Mobile SiP decreases footprint more than 40% than discrete

키워드