한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)

한국마이크로전자및패키징학회 (The Korean Microelectronics and Packaging Society)
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A Consideration of High Speed Signal Transmission in Clip Chip Carrier and Future Direction

  • 발행 : 2006.10.11
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초록

[ $\bullet$ ] Miniaturization of packaging size is a key for system performance. $\bullet$ Fundamental density increase of joint and carrier wiring are required in near future.

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