한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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- Pages.125-134
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- 2006
The New Generation Laser Dicing Technology for Ultra Thin Si wafer
- Kumagai, Masayoshi (Hamamatsu Photonics K.K.) ;
- Uchiyama, N. (Hamamatsu Photonics K.K.) ;
- Atsumi, K. (Hamamatsu Photonics K.K.) ;
- Fukumitsu, K. (Hamamatsu Photonics K.K.) ;
- Ohmura, E. (Osaka Univ.) ;
- Morita, H. (Hamamatsu Photonics K.K.)
- 발행 : 2006.10.11
초록
Process & mechanism
키워드