Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Super Chip Integration Based on Chip-to-Wafer 3D Integration Technology

  • Tanaka, Tetsu (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.) ;
  • Fukushima, T. (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.) ;
  • Koyanagi, M. (Department of Bioenginerring and Robotics, Graduate School of Engineering, Tohoku Univ.)
  • Published : 2006.10.11
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