대한용접접합학회:학술대회논문집 (Proceedings of the KWS Conference)
- 대한용접접합학회 2005년도 추계학술발표대회 개요집
- /
- Pages.231-233
- /
- 2005
레이저 공정에 따른 BGA용 solder ball의 접합 특성
Bonding properties of BGA solder ball with laser process
- 김성욱 (RIST 용접센터) ;
-
김숙환
(RIST 용접센터)
;
-
윤병현
(RIST 용접센터)
;
-
천창근
(RIST 용접센터)
;
- 박재현 (RIST 신뢰성 평가 센터) ;
- 권영각 (RIST 용접센터)
- Kim, Seong-Uk ;
-
Kim, Suk-Hwan
;
-
Yun, Byeong-Hyeon
;
-
Cheon, Chang-Geun
;
- Park, Jae-Hyeon ;
- Gwon, Yeong-Gak
- 발행 : 2005.11.17
초록
Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.
키워드