Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2005.11a
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- Pages.219-221
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- 2005
Reliability study of Sn-Zn lead-free solder for SMT application
표면실장 적용을 위한 Sn-Zn 무연 솔더의 신뢰성 연구
- Published : 2005.11.17
Abstract
Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were
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